COVOT

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COVOT

COVOT is the wafer transfer robot in the heigh vacuum enviroment, designed based on longtime experience and technique. Rigidity is high and is superior in position precision.

Features

  • Magnetic fluid sealing is adopted as a vacuum seal, and it corresponds to the high vacuum to 10-6Pa.
  • Controller and a robot into an integral type. compact equipment layout is realizable.
  • 360-degree continuation rotation is possible, there are no restrictions in the attachment direction.

Applications

  • Automatic wafer transfer for various semiconductor equipments
  • Wafer transfer for various vacuum eqipment for R&D

Specifications

Pressure rangeto 10-6Pa
Wafer size200mm/300mm
Number of wafer1 or 2
Maximum distance*1050mm
Rotation360º Endless
Z-axis stroke50mm
Minimum rotation diameter *944mm
Weight capacity (hand is included)1kg
SpeedRMax 2.5sec / full stroke
θMax 2.5sec / 180º
ZMax 1.5sec / 20mm
Position AccuracyR±0.2mm
θ±0.2mm
Z±0.2mm
Teaching pendantAttached
ControllerBuilt-in type

*Changes by the arm and hand.

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COVOT