AC Method Thermal Diffusivity Measuring

MEASURES THE IN-PLANE THERMAL DIFFUSIVITY AND DERIVED THERMAL CONDUCTIVITY OF THIN FILMS AND THE THERMAL DIFFUSIVITY OF THIN BULK MATERIAL SAMPLES

 

The LaserPIT series uses the Angstrom method of AC periodic scanning laser heating to measure the in plane thermal diffusivity of thin materials and deposited films. The derived thermal conductivity of high thermal conductivity sub-micron deposited thin films can also be measured with this instrument.

 

APPLICATIONS

• Thermal conductivity evaluations of high conductivity thin sheet materials such as diamond, aluminum nitride, SiC
• Thermal conductivity evaluations of various metallic thin film
• Thermal conductivity evaluations of organic films in plane direction such as heat radiating sheets

FEATURES

• Capable of measuring the thermal diffusivity of a wide range of thin sheet materials from room temperature to 200°C
• Capable of measuring the thermal conductivity of 100 nm or thicker thin films deposited on substrates by a newly developed differential method

FEATURES
AC Method Thermal Diffusivity Measuring