| Pressure range | to 10-1Pa | |
| Wafer size | 300mm | |
| Number of wafer | 4 | |
| Maximum distance* | 880mm | |
| Rotation | 360º Endless | |
| Z-axis stroke | 90mm | |
| Minimum rotation diameter * | 980mm | |
| Weight capacity (hand is included) | 1kg | |
| Speed | R | Max 1.5sec / full stroke |
| θ | Max 2.0sec / 180º | |
| Z | Max 1.5sec / 20mm | |
| Position Accuracy | R | ±0.2mm |
| θ | ±0.2mm | |
| Z | ±0.2mm | |
| Teaching pendant | Attached | |
| Controller | Separation type | |
*Changes by the arm and hand.