REACTIVE PROCESS GAS MONITORING SYSTEM - QULEE RGM SERIES
REACTIVE PROCESS GAS MONITORING SYSTEM - QULEE RGM SERIES
This process monitoring system has been developed for various kinds of applications such as etch, CVD and other reactive gas processes. Using ULVAC’s original ion source and pumping system enables you to achieve stable measurements results.
Most Appropriate for Etching/CVD Apparatus Long term stable measurements results
Closed Ion Source Utilizing a Magnetic Field Soft ionization provides less gas dissociation and higher sensitivity. Decomposition and adsorption due to thermal reactions are minimized in the ionization chamber.
Compact Conductance Valve with 3 Different Gas Inlet Modes Short distance between the process chamber and ion source allows quick-response of analysis.
Suitable for Process Monitoring Wide pressure range from 1×10-6 to 13kPa (7.5×10-9 to 97.5 Torr, 1×10-8 to 130mbar) is available. (Choice of oriices)
Integrated Display No need for PC
Simple Operation "One Click" function
Bake Out Max 120˚C (248˚F) High temperature bake
Degas Function Electron bombard degas
Protection and Maintenance Feautures Protection and maintenance of ion source and secondary electron multiplier Traceability of analysis tube (patent pending)
Various Leak Tests are Available Helium leak test, air leak test, leak up
Total Pressure Measurement Capable of total pressure measurement (External ionization gauge (GI-M2)
Qulee QCS is Included This software is included and compatible with (Windows XP/7)
SPECIAL FEATURES / FURTHER APPLICATIONS
For etching and CVD process
Monitoring reactive gases during process
End-point monitoring for etching and cleaning processes
